Implemental process defective factor analysis manner

摘要

PURPOSE: To automatically analyze causes of failures by comparing test results of the respective steps of printing, mounting, and soldering with one another for every printed board that is the mounting target. ;CONSTITUTION: The quality results of respective steps of printing step 1, mounting step 2, and soldering step 3 in component mounting inputted through a means to input these results for every printed board, a quality failure relative rule recorder 10 which indicates the possibility of relative occurrence, and print result input means 5, mount result input means 7, and soldering result input means 9 are compared for every printed board, so that the influence degrees of the respective steps on final failures are calculated in reference to the quality failure relative rule, whereby it is possible to predicate causes of failures automatically.;COPYRIGHT: (C)1994,JPO&Japio