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Chemical analysis of the defect which uses electronic appearance spectroscopy

机译:使用电子外观光谱对缺陷进行化学分析

摘要

The semiconductor wafer or the other baseplates (12) the surface particulate which can exist on (22) or the technology which measures the chemical composition of other small features. The particulate is irradiated the focus incident electron beam of variable energy (92) with. The x-ray or electronic radiation from the said particulate (94), in order to detect the increase of the output which indicates the ionization threshold value of the substance in the particulate it is watched. As for incident beam energy, in order to measure the kind which exists in the particulate are threshold value and the correlation which are detected.
机译:半导体晶片或其他基板(12)可存在于(22)上的表面微粒或用于测量其他小特征的化学组成的技术。颗粒被可变能量的焦点入射电子束辐照(92)。来自所述微粒(94)的X射线或电子辐射,以便检测输出的增加,该输出指示所观察的微粒中物质的电离阈值。对于入射束能量,为了测量颗粒中存在的种类,检测阈值和相关性。

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