Thermal resistance calculation method and a recording medium and a heat resistance computing device of semiconductor package

摘要

PROBLEM TO BE SOLVED: To easily obtain the thermal resistance of a semiconductor package, by using each thermal resistance of a radiation path passing through the rear surface of a case, a radiation path passing through a lead frame, and a radiation path passing through a side part, the thermal resistance between a semiconductor chip and the surface of the case, and the thermal resistance of a cooling fin single substance. ;SOLUTION: In a semiconductor package, a semiconductor chip 1 being mounted onto an island 8 is molded by resin 3 in a case 7, and a lead frame 2 being extended in all directions from the inside of the case 7 is connected to the semiconductor chip 1 by a bonding wire 9. In this case, the thermal resistance of the semiconductor package with a cooling fin 11 being mounted onto the surface of the case 7 is obtained according to the thermal resistance of a radiation path passing through the rear surface of the case 7, the thermal resistance of a radiation path passing through a lead frame 2, the thermal resistance of a radiation path passing through a side part other than the lead frame, the thermal resistance between the semiconductor chip 1 and the surface of the case 7, and the thermal resistance of the single substance of a cooling fin 11.;COPYRIGHT: (C)1999,JPO