Mirror surface molding wafer, grinding cross, and mirror surface molding grinding device and method for mirror surface molding

摘要

The mirror surface molding wafer which controls wafer peripheral dare, the grinding cross for the said wafer processing and grinding device, and grinding method are offered. As for the aforementioned wafer, it is offered by controlling the over polish width in mirror surface bevelling 400 millimicrons or less. In addition, the aforementioned grinding cross makes the multilayer structure which pastes together at least 2 layer of abrasive cloth layer of ground car C hardness 65 or more and sponge layer of ground car C hardness 40 or less, or or, makes monolayer structure only of the aforementioned abrasive cloth layer. Furthermore, the aforementioned grinding device, grinding method while in the rotating drum which sticks the above-mentioned grinding cross, as the wafer which turns due to the slewing mechanism is made to contact with specified angle making the grinding liquid the particular contact part supply is offered by the fact that it does mirror surface molding.