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METHOD AND APPARATUS FOR MEASURING STRENGTH OF BASE MATERIAL SURFACE LAYER

机译:测量基体材料表面层强度的方法和装置

摘要

PROBLEM TO BE SOLVED: To provide a method and apparatus for measuring strength of a base material surface layer that accurately measures even in the case of a base material having a local minute region, a three-dimensional shape or an uneven surface with a gurge formed thereon. ;SOLUTION: The apparatus includes a pressure detector for detecting cutting resistance Fh generated by a cutter 7 cutting a measured surface of a base material 11 fixed on a support, a measuring device for detecting an internal cut amount d, and a means for adjusting cutting speeds Vh and Vv. From an image photographed by a CCD camera, at least one of an opening length, an opening displacement, and a curvature radius of a chip generated when the cutter 7 cuts the base material surface layer is calculated. An energy release rate is obtained from at least one of the measurements and the cut resistance Fh generated by the cutter 7. Based on the energy release rate, release strength of the base material surface layer is calculated.;COPYRIGHT: (C)2004,JPO
机译:解决的问题:提供一种用于测量基材表面层的强度的方法和设备,该方法和设备即使在具有局部微小区域,三维形状或形成有凸起的不平坦表面的基材的情况下也可以准确地进行测量在其上。 ;解决方案:该设备包括:压力检测器,用于检测由刀具7切割固定在支撑件上的基材11的测量表面所产生的切削阻力Fh;用于检测内部切削量d的测量装置;以及用于调节切削的装置。速度Vh和Vv。根据由CCD照相机拍摄的图像,计算出当切割器7切割基材表面层时产生的切屑的开口长度,开口位移和曲率半径中的至少一个。从测量值和刀具7产生的耐切割性Fh中的至少一项获得能量释放速率。基于能量释放速率,计算基材表面层的释放强度。;版权:(C)2004,日本特许厅

著录项

  • 公开/公告号JP2003344265A

    专利类型

  • 公开/公告日2003-12-03

    原文格式PDF

  • 申请/专利权人 MATSUSHITA ELECTRIC WORKS LTD;

    申请/专利号JP20020154245

  • 发明设计人 IKEGAWA NAOTO;SATO MASAHIRO;

    申请日2002-05-28

  • 分类号G01N19/04;G01B11/02;G01B11/08;

  • 国家 JP

  • 入库时间 2022-08-21 23:23:12

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