ELECTRONIC COMPONENT INSPECTION METHOD AND CERAMIC SUBSTRATE INSPECTION METHOD

摘要

PROBLEM TO BE SOLVED: To provide an inspection method for quickly and inexpensively detecting a minute quantity of residual or adsorbed moisture in the electrode structure part or substrate of an electronic component having a ceramic base material such as a chip electronic component, a ceramic substrate, etc., by a simple method and with a small quantity of a sample and visually identifying a moisture appearance location. ;SOLUTION: The chip electronic component 9 or the ceramic substrate 10 is dipped and left in a hydrophobic organic solvent 6 with a high boiling point previously heated to 100°C or higher. If the moisture is included in the electrode of the chip electronic component 9 or the ceramic substrate 10, the moisture is vaporized and becomes air bubbles immediately after dipping and the air bubbles are discharged from the electrode or a surface of the ceramic substrate. Since a video camera 8 shoots behavior of the discharged air bubbles, a quantity and the appearance location of the appearing moisture can be visually confirmed.;COPYRIGHT: (C)2004,JPO