Method of packaging a quad flat no-lead semiconductor and a quad flat no-lead semiconductor

摘要

A method of packaging a QFN semiconductor uses a metal frame having multiple component carriers consisting of die pads and leads attached to a tape. Dies are respectively attached to and wire bonded to the component carriers. A glue wall is formed around all of the component carriers on the metal frame. When the transparent encapsulant is poured inside the glue wall, the dies and the component carriers are covered. After the tape is removed, the component carriers are cut out of the metal frame to complete the QFN semiconductors. Therefore, the method can increase the quantity and quality of QFN semiconductors produced without regard to the size of the individual QFN semiconductors.