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Thinning techniques for wafer-to-wafer vertical stacks
Thinning techniques for wafer-to-wafer vertical stacks
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机译:晶圆间垂直堆叠的减薄技术
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摘要
Methods for thinning wafer-to-wafer vertical stacks in the fabrication of stacked microelectronic devices. The methods include physically removing unsupported portions of a wafer to be thinned in the vertical stack. The removal of the unsupported portions substantially eliminates potential cracking and chipping of the wafer, which can occur during the thinning process when the unsupported portions exist.
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