首页> 外国专利> Substrate with multilayer film, reflection type mask blank for exposure, reflection type mask for exposure and production method thereof as well as production method of semiconductor device

Substrate with multilayer film, reflection type mask blank for exposure, reflection type mask for exposure and production method thereof as well as production method of semiconductor device

机译:带多层膜的基板,曝光用反射型掩模坯料,曝光用反射型掩模及其制造方法以及半导体装置的制造方法

摘要

In a reflection type mask blank for EUV exposure with a substrate, a multilayer film is formed on the substrate so as to reflect an EUV light ray. A light absorber layer is formed on the multilayer film so as to absorb the EUV light ray. The multilayer film has flatness with respect to a surface thereof, and the flatness is 100 nm or less.
机译:在用于用基板进行EUV曝光的反射型掩模坯料中,在基板上形成多层膜以反射EUV光线。在多层膜上形成吸光层,以吸收EUV光线。多层膜相对于其表面具有平坦度,并且该平坦度为100nm以下。

著录项

  • 公开/公告号US6737201B2

    专利类型

  • 公开/公告日2004-05-18

    原文格式PDF

  • 申请/专利权人 HOYA CORPORATION;

    申请/专利号US20010987990

  • 发明设计人 MORIO HOSOYA;TSUTOMU SHOKI;

    申请日2001-11-16

  • 分类号G03F90/00;

  • 国家 US

  • 入库时间 2022-08-21 23:17:11

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