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Micromachined structures including glass vias with internal conductive layers anodically bonded to silicon-containing substrates
Micromachined structures including glass vias with internal conductive layers anodically bonded to silicon-containing substrates
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机译:包括玻璃通孔的微机械结构,该玻璃通孔的内部导电层阳极键合到含硅基板上
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摘要
Disclosed herein are methods of preparing vertical electrical interconnects within multiple layers of substrates, where a portion of the substrate layers are glass and a portion of the substrate layers are single-crystal silicon. The methods taught herein can be used to prepare basic “units” which can be stacked and anodically bonded together to form electrically connected, multi-unit structures. The methods of the invention are particularly advantageous in the fabrication of microcolumns, and especially an array of microcolumns of the kind used in electron optics, including electron microscopes and lithography apparatus.
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