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Method of controlling metallic layer etching process and regenerating etchant for metallic layer etching layer etching process based on near infrared spectrometer

机译:基于近红外光谱仪的控制金属层刻蚀工艺并再生用于金属层刻蚀层刻蚀工艺的刻蚀剂的方法

摘要

In a method of controlling a metallic layer etching process for fabricating a semiconductor device or a liquid crystal display device, the composition of the etchant used in etching the metallic layer is first analyzed with the NIR spectrometer. The state of the etchant is then determined by comparing the analyzed composition with the reference composition. In case the life span of the etchant comes to an end, the etchant is replaced with a new etchant. By contrast, in case the life span of the etchant is left over, the etchant is delivered to the next metallic layer etching process. This analysis technique may be applied to the etchant regenerating process in a similar way.
机译:在控制用于制造半导体装置或液晶显示装置的金属层蚀刻工艺的方法中,首先用NIR光谱仪分析用于蚀刻金属层的蚀刻剂的成分。然后通过将分析的成分与参考成分进行比较来确定蚀刻剂的状态。万一蚀刻剂的寿命到期,则用新的蚀刻剂代替蚀刻剂。相反,如果保留了蚀刻剂的寿命,则将蚀刻剂输送到下一个金属层蚀刻工艺。该分析技术可以类似的方式应用于蚀刻剂再生过程。

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