首页> 外国专利> Polymeric chemical injection into a water jet to improve cut quality while cutting very brittle materials

Polymeric chemical injection into a water jet to improve cut quality while cutting very brittle materials

机译:将聚合物化学注入水刀中以提高切割质量,同时切割非常脆的材料

摘要

The present invention relates to methods and systems for isolating non-rectangular shaped optical integrated circuits formed on a brittle substrate. For example, a brittle substrate comprising a plurality of non-rectangular shaped optical integrated circuits is provided on a water jet cutting system. In the water jet cutting system a mixture of water and at least one water soluble polymer is wet injected into a water stream and then a high pressure polymer water jet is used to cut the brittle substrate. The non-rectangular shaped optical integrated circuits are isolated by water jet cutting in a curvilinear manner without fatally damaging adjacent optical integrated circuits.
机译:本发明涉及用于隔离形成在脆性衬底上的非矩形光学集成电路的方法和系统。例如,在喷水切割系统上提供包括多个非矩形光学集成电路的脆性基板。在水喷射切割系统中,将水和至少一种水溶性聚合物的混合物湿注入到水流中,然后使用高压聚合物水喷射切割脆性基材。通过以水射流切割以曲线方式隔离非矩形光学集成电路,而不会致命地损坏相邻的光学集成电路。

著录项

  • 公开/公告号US6676486B1

    专利类型

  • 公开/公告日2004-01-13

    原文格式PDF

  • 申请/专利权人 LIGHTWAVE MICROSYSTEMS CORPORATION;

    申请/专利号US20010909603

  • 发明设计人 DAVID J. QUIRKE;

    申请日2001-07-20

  • 分类号B24C10/00;

  • 国家 US

  • 入库时间 2022-08-21 23:15:13

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