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Fabricating process of non-gap 3-D microstructure array mold core

机译:无间隙3-D微结构阵列模芯的制造工艺

摘要

A process of fabricating a non-gap 3-D microstructure array mold core comprises a first step in which a buffer layer is coated on a substrate. A photomask layer is then coated of the buffer layer. A pattern is subsequently formed on the photomask by photo-lithography. The patterned photomask layer is subjected to a reflow by which a microstructure array is formed on the photomask layer. The microstructure array is coated with a metal conductive layer. The microgaps of the microstructure array are eliminated by an electrocasting layer which is coated on the microstructure array. The non-gap microstructure array mold core so fabricated is made into a metal molding tool by microinjection molding or microthermo-pressure molding.
机译:制造非间隙3-D微结构阵列模具芯的方法包括第一步,其中将缓冲层涂覆在基底上。然后将光掩模层涂覆缓冲层。随后通过光刻在光掩模上形成图案。对图案化的光掩模层进行回流,由此在光掩模层上形成微结构阵列。所述微结构阵列涂覆有金属导电层。通过涂覆在微结构阵列上的电铸层消除了微结构阵列的微间隙。通过微注射成型或微热压成型将如此制造的无间隙微结构阵列模具芯制成金属成型工具。

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