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Cooper clad laminate with cooper-plated circuit layer, and method for manufacturing printed wiring board using the copper clad laminate with cooper-plated circuit layer
Cooper clad laminate with cooper-plated circuit layer, and method for manufacturing printed wiring board using the copper clad laminate with cooper-plated circuit layer
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机译:具有镀铜电路层的覆铜层压板以及使用具有镀铜电路层的覆铜层压板的印刷线路板的制造方法
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摘要
The object of the present invention is to provide a copper clad laminate with a copper-plated circuit layer, and a method for manufacturing a printed wiring board that excels the conventional ones in the aspect ratio of a circuit pattern when processed to a printed wiring board comprising a fine-pitch circuit. The object of the present invention is achieved by manufacturing a printed wiring board with the use of a copper clad laminate with a copper-plated circuit layer characterized by a copper-plated circuit layer and an outer-layer copper foil layer that satisfied the relationship in a case where a specific etchant is used, the R v value (Vsc/Vsp), which is the ratio of the dissolution rate (Vsp) of deposited copper that constitutes said copper-plated circuit layer to the dissolution rate (Vsc) of copper that constitutes said outer-layer copper foil layer, is 1.0 or more.
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