首页> 外国专利> Correction factors for the analysis of piezoelectric devices

Correction factors for the analysis of piezoelectric devices

机译:压电器件分析的校正因子

摘要

Techniques are provided for determining certain correction factors and using these correction factors in analyzing the vibration frequency characteristics of a piezoelectric material. The correction factors are developed based on the Mindlin plate theory and are introduced to correct the inaccuracies of higher-order thickness-shear cut-off frequencies. The analysis is preferably carried out during the design of a piezoelectric device incorporating the piezoelectric material and before production of the piezoelectric device. The design state may also include determining whether the device and its electrodes exhibit appropriate stiffness characteristics.
机译:提供了用于确定某些校正因子并使用这些校正因子来分析压电材料的振动频率特性的技术。校正因子是基于Mindlin板理论开发的,并被引入以校正高阶厚度-剪切截止频率的不准确性。该分析优选地在包含压电材料的压电装置的设计期间以及在压电装置的制造之前进行。设计状态还可以包括确定装置及其电极是否表现出适当的刚度特性。

著录项

  • 公开/公告号US6654711B1

    专利类型

  • 公开/公告日2003-11-25

    原文格式PDF

  • 申请/专利权人 SEIKO EPSON CORPORATION;

    申请/专利号US19990333721

  • 申请日1999-06-15

  • 分类号G06F175/00;G06F171/00;G06F76/00;G06G76/20;

  • 国家 US

  • 入库时间 2022-08-21 23:13:22

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号