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Growth of epitaxial semiconductor material with improved crystallographic properties

机译:具有改善的晶体学性能的外延半导体材料的生长

摘要

A method of growing epitaxial semiconductor layers with reduced crystallographic defects. The method includes etching the wafer surface and then growing an initial portion of the epitaxial layer under conditions of relatively high temperature and low source gas flow to heal defects in or on the surface of the substrate. Subsequently, the remainder of the epitaxial layer is grown under high growth rate conditions resulting from high source gas flow. The initial portion of the epitaxial layer acts as a low-defect seed layer by preventing defects in the surface of the substrate from propagating into the remainder of the epitaxial layer. However, the relatively high source gas flow permits the remainder epitaxial layer to be grown at a faster rate than the initial portion of the epitaxial layer.
机译:一种生长具有减少的晶体学缺陷的外延半导体层的方法。该方法包括蚀刻晶片表面,然后在相对高温和低源气体流量的条件下生长外延层的初始部分,以修复衬底表面内或表面上的缺陷。随后,外延层的其余部分在高源气体流量导致的高生长速率条件下生长。外延层的初始部分通过防止衬底表面中的缺陷传播到外延层的其余部分中而充当低缺陷种子层。然而,相对高的源气体流量允许其余的外延层以比外延层的初始部分更快的速率生长。

著录项

  • 公开/公告号US6703290B2

    专利类型

  • 公开/公告日2004-03-09

    原文格式PDF

  • 申请/专利权人 SEH AMERICA INC.;

    申请/专利号US20020319999

  • 发明设计人 OLEG V. KONONCHUK;MARK R. BOYDSTON;

    申请日2002-12-16

  • 分类号H01L212/00;

  • 国家 US

  • 入库时间 2022-08-21 23:12:54

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