LASER BASED METHOD AND SYSTEM FOR INTEGRATED CIRCUIT REPAIR OR RECONFIGURATION

摘要

The present invention provides a method and system for irradiating resistmaterial from multiple target positions (150) on one ormore IC chips (12) with individually directed laser output pulses (74, 94). Inone embodiment, an IC (12), including one or more etchtargets (104, 106) such as conductive links (72, 92), is coated with an etchprotection layer (90) of photoresist material. Then, position datadirect, toward multiple positions (150) on the photoresist material,individual laser output pulses (94) of predetermined parameters selectedto expose the photoresist material. Because photoresist exposure requires lessenergy than link blowing, low-power UV lasers (120) canbe employed, and their shorter wavelengths permit a smaller practical laseroutput spot size (98). Because the nonablative process doesnot generate debris, an optical component (148) can be brought within 10 mm ofetch protection layer (90) to focus the laser output pulses(94) to a spot size of less than two times the wavelength of laser output(140). Thus, an advantage of this embodiment permits microcircuitmanufacturers to decrease the pitch distance (28) between circuit elements(14). After the photoresit layer (90) is developed, the accessibleetch target (92) can be etched to repair or reconfigure the IC device. Inanother embodiment, slightly higher UV power laser output pulses(74) can be employed to ablate an etch protection resist layer (70) so anytype of etch protection coating such as nonphotosensitive resistmaterials can be utilized with substantial manufacturing and cost benefits.Etching of the accessible etch targets (60, 62) follows thisprocess.