首页> 外国专利> AUTOMATIC REFERENCE POSITION TEACHING METHOD, AUTOMATIC POSITIONING METHOD, AND AUTOMATIC CARRYING METHOD FOR DISK-LIKE OBJECT, AUTOMATIC REFERENCE POSITION TEACHING DEVICE, AUTOMATIC POSITIONING DEVICE, AND AUTOMATIC CARRYING DEVICE FOR DISK-LIKE OBJECT USING THESE METHODS, AND AUTOMATIC SEMICONDUCTOR MANUFACTURING EQUIPME

AUTOMATIC REFERENCE POSITION TEACHING METHOD, AUTOMATIC POSITIONING METHOD, AND AUTOMATIC CARRYING METHOD FOR DISK-LIKE OBJECT, AUTOMATIC REFERENCE POSITION TEACHING DEVICE, AUTOMATIC POSITIONING DEVICE, AND AUTOMATIC CARRYING DEVICE FOR DISK-LIKE OBJECT USING THESE METHODS, AND AUTOMATIC SEMICONDUCTOR MANUFACTURING EQUIPME

机译:针对对象的自动参考位置教学方法,针对对象的自动定位方法和自动携带方法,针对对象的针对对象的自动参考位置教学设备,自动定位设备和自动携带设备,使用这些方法的对象,方法

摘要

An automatic reference position teaching method for disk-like object capable of increasing a productivity by automating reference position teachings at ports and a positioning in a stationary production process when equipment is started in a semiconductor manufacturing equipment having a positioning device and a carrying robot, comprising the steps of detecting two points W1 and W2 where the circumference of a disk-like object (47) such as a wafer crosses the locus (43) of a detection means, and calculating the center position A of the disk-like object by using these two points, a specific point O on the vertical bisector (42) of a line segment connecting these two points, and the radius r of the disk-like object, whereby positioning operation can be performed by the carrying robot, and not only the correction of a carrying route but also the reference position teaching at the time of starting of the equipment can be automated by using the results of the positioning operation. When a cutout part is present in the disk-like object, the circumference of the disk-like object is detected by two loci of the detection means to find out a correct center position, and the circumference of the disk-like object with an unknown radius is detected by three loci of the detection means to obtain the radius so as to allow a mixed production using wafers with different diameters.
机译:在具有定位装置和搬运机器人的半导体制造装置中,在启动设备时,通过在静止的生产过程中通过自动进行口处的基准位置教导和定位来自动进行定位,从而能够提高生产率的圆盘状对象物的自动基准位置教导方法,其包括:检测两个点W1和W2的步骤,其中晶片等圆盘状物体(47)的圆周与检测装置的轨迹(43)相交,并通过使用计算圆盘状物体的中心位置A这两个点,连接这两个点的线段的垂直平分线(42)上的特定点O,以及圆盘状物体的半径r,从而可以由搬运机器人执行定位操作,而不仅仅是通过使用定位操作的结果,可以自动进行搬运路线的校正以及设备启动时的参考位置示教。当在圆盘状物体中存在切口部分时,通过检测装置的两个轨迹检测圆盘状物体的周长,以找出正确的中心位置,并且圆盘状物体的周长未知。通过检测装置的三个轨迹检测半径,以获得半径,从而允许使用具有不同直径的晶片进行混合生产。

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