首页> 外国专利> PRINTED WIRING BOARD, MULTILAYER PRINTED WIRING BOARD, AND, METHOD OF DETECTING FOREIGN MATTER AND VOIDS IN INNER LAYER OF MULTILAYER PRINTED WIRING BOARD

PRINTED WIRING BOARD, MULTILAYER PRINTED WIRING BOARD, AND, METHOD OF DETECTING FOREIGN MATTER AND VOIDS IN INNER LAYER OF MULTILAYER PRINTED WIRING BOARD

机译:印刷线路板,多层印刷线路板以及检测多层印刷线路板内层中异物和空隙的方法

摘要

In a multilayer printed wiring board, a first electrode 20 and a second electrode 23 adjacent to said first electrode 20 are formed in an internal layer portion 11B of the waste substrate portion of the multilayer printed wiring board, and a first terminal portion electrically connected to the first electrode 20 and a second terminal portion electrically connected to the second electrode 23 are formed on an outer surface.
机译:在多层印刷线路板中,第一电极20和与所述第一电极20相邻的第二电极23形成在多层印刷线路板的废基板部分的内层部分11B中,并且第一端子部分电连接至第一电极20和电连接到第二电极23的第二端子部分形成在外表面上。

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