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TO-CAN PACKAGE FOR 10GBPS OPTICAL MODULE

机译:可以封装10GBPS光学模块

摘要

The present invention discloses a TO-CAN package for a 10Gbps optical module including a stem for receiving an optical device, and a lead connected to the optical device through an opening of the stem. The package includes an RF feed line having a first lead being covered with a first insulation layer by a predetermined length from the outside to the ingress of the opening of the stem, and existing outside the TO-CAN package, a second lead passing through and existing in the opening of the stem filled with a second insulation layer, and a third lead existing in the TO-CAN package, at least part of the circumference of which being covered with a third insulation layer by a predetermined length, the first to third leads being incorporated in a single body.
机译:本发明公开了一种用于10Gbps光学模块的TO-CAN封装,该TO-CAN封装包括用于容纳光学装置的杆以及通过杆的开口连接至光学装置的引线。该封装包括:RF馈线,其第一引线从外部到阀杆开口的入口以预定长度覆盖有第一绝缘层,并且存在于TO-CAN封装的外部,第二引线穿过并穿过存在于填充有第二绝缘层的阀杆的开口中,以及存在于TO-CAN封装中的第三引线,其至少一部分圆周被第三绝缘层覆盖预定长度,第一至第三引线被整合到一个整体中。

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