PLASTIC HOUSING COMPRISING SEVERAL SEMICONDUCTOR CHIPS AND A WIRING MODIFICATION PLATE, AND METHOD FOR PRODUCING THE PLASTIC HOUSING IN AN INJECTION-MOULDING MOULD

摘要

The invention relates to a plastic housing (14) comprising several semiconductor chips (3) and a wiring modification plate (11), on which the semiconductor chips (3) are arranged, and to an injection moulding-mould for producing said plastic housing (14), in addition to an electronic component, which can be produced by the combination of the injection-moulding mould, wiring modification plate (11) and plastic housing (14). The invention also relates to a method, which uses the inventive wiring modification plate (11) and the two-part injection-moulding mould, to produce a plastic housing of this type (14) comprising several semiconductor chips (3) for several electronic components.