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PLASTIC HOUSING COMPRISING SEVERAL SEMICONDUCTOR CHIPS AND A WIRING MODIFICATION PLATE, AND METHOD FOR PRODUCING THE PLASTIC HOUSING IN AN INJECTION-MOULDING MOULD
PLASTIC HOUSING COMPRISING SEVERAL SEMICONDUCTOR CHIPS AND A WIRING MODIFICATION PLATE, AND METHOD FOR PRODUCING THE PLASTIC HOUSING IN AN INJECTION-MOULDING MOULD
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机译:包括几个半导体芯片和一个接线修改板的塑料外壳,以及在注射模制模具中生产塑料外壳的方法
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摘要
The invention relates to a plastic package (14) with a plurality of semiconductor chips (3) and also a wiring board (11), on which the semiconductor chips (3) are arranged, and to an injection mold for producing the plastic package (14) and also to an electronic component which can be produced with the aid of the combination of the injection mold, wiring board (11) and plastic package (14). Furthermore, the invention relates to a method which, using the wiring board (11) according to the invention and the two-part injection mold, makes it possible to produce a plastic package (14) of this type with a plurality of semiconductor chips (3) for a plurality of electronic components.
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