首页> 外国专利> Method of fabricating semiconductor device with ultra-shallow super-steep-retrograde epi-channel by decaborane doping

Method of fabricating semiconductor device with ultra-shallow super-steep-retrograde epi-channel by decaborane doping

机译:十硼烷掺杂制造超浅超硬逆向epi沟道半导体器件的方法

摘要

PURPOSE: A method for manufacturing a semiconductor device with an ultra-shallow super-steep-retrograde epi-channel is provided to improve the productivity of ultra low energy implantation by using decaborane doping. CONSTITUTION: A channel doping layer(35a) is formed in a semiconductor substrate(31) by implanting decaborane. An epitaxial layer(36) is formed on the channel doping layer(35a). A gate oxide layer(37) and a gate electrode(38) are sequentially formed on the epitaxial layer(36). An SDE(Source/Drain Extension) region(39) is formed in the substrate to align edges of the gate electrode(38), wherein the depth of the SDE region(39) is shallower than that of the channel doping layer(35a). A spacer(40) is formed at both sidewalls of the gate electrode. A source/drain region(41) having a relatively deep depth compared to the channel doping layer, is then formed to align edges of the spacer.
机译:目的:提供一种用于制造具有超浅超陡逆行外延沟道的半导体器件的方法,以通过使用十硼烷掺杂来提高超低能量注入的生产率。构成:通过注入十硼烷在半导体衬底(31)中形成沟道掺杂层(35a)。在沟道掺杂层(35a)上形成外延层(36)。在外延层(36)上依次形成栅氧化层(37)和栅电极(38)。在衬底中形成SDE(源/漏扩展)区域(39)以对准栅电极(38)的边缘,其中,SDE区域(39)的深度比沟道掺杂层(35a)的深度浅。 。在栅电极的两个侧壁处形成有间隔物(40)。然后形成与沟道掺杂层相比具有相对深的深度的源极/漏极区域(41),以对准间隔物的边缘。

著录项

  • 公开/公告号KR20030089764A

    专利类型

  • 公开/公告日2003-11-28

    原文格式PDF

  • 申请/专利权人 HYNIX SEMICONDUCTOR INC.;

    申请/专利号KR20020027616

  • 发明设计人 JU SEONG JAE;SON YONG SEON;

    申请日2002-05-18

  • 分类号H01L21/336;

  • 国家 KR

  • 入库时间 2022-08-21 22:50:48

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