POLYIMIDE FILM AND METAL LAYERED PLATE USING THE POLYIMIDE FILM FOR OBTAINING LOW HYGROSCOPIC EXPANSION COEFFICIENT, LOW LINEAR EXPANSION COEFFICIENT, HIGH ELASTIC MODULUS AND GOOD METAL ADHESION

摘要

PURPOSE: A polyimide film and a metal layered plate using the polyimide film are provided, to reduce thermal shrinkage at 300 deg.C, to improve alkali etching resistance and stability under severe environmental condition and to obtain high maintenance of metal adhesion even after environment resistance test. CONSTITUTION: The polyimide film has a tanδ of dynamic viscoelasticity of 310-410 deg.C and a tanδ of 0.05 or less at 300 deg.C. Preferably the polyimide film is prepared by copolymerizing an acid dianhydride component and a diamine component. The acid dianhydride component comprises a pyromellitic dianhydride represented by the formula 1 and the diamine component comprises a p-phenylene diamine represented by the formula 2 and a diaminodiphenyl ether represented by the formula 3, wherein R1's are identical or different each other and are H, CF3, CH3, Cl, Br, F or CH3O; R2 is a divalent aromatic group; and R4 is a divalent organic group.