FILM PATTERN FORMING METHOD BY SETTING CONTACT ANGLE FROM 15 TO 45 DEGREES, THIN FILM MANUFACTURING APPARATUS, CONDUCTIVE FILM WIRING, ELECTRO-OPTIC APPARATUS, ELECTRONIC DEVICE, AND NON-CONTACT CARD MEDIUM

摘要

PURPOSE: A film pattern forming method, a thin film manufacturing apparatus, a conductive film wiring, an electro-optic apparatus, an electronic device, and a non-contact card medium are provided to protect a film pattern formed by an inkjet method from defects including short circuits. CONSTITUTION: A film pattern forming method comprises a surface treatment process for performing a surface treatment on a substrate prior to discharge of liquid drop. A contact angle of the liquid drop on the substrate is set by the surface treatment process. The contact angle ranges from 15 to 45 degrees. A thin film manufacturing apparatus includes a discharge unit for discharging liquid drop onto a substrate; and a surface treatment unit for surface treating the substrate.