ADHERING METHOD FOR FIXING CHIP TO RESIN FILM AND ADHERING APPARATUS TO PREVENT GENERATION OF BUBBLES OR INFERIOR AGING DUE TO VOID

摘要

PURPOSE: An adhering method and an adhering apparatus are provided, to improve the adhering quality by preventing the generation of bubbles or the inferior aging due to void. CONSTITUTION: The adhering method comprises the steps of semi-curing an adhesive by heating; discharging the semi-cured adhesive in a desired amount from a fine hole to place it on a discharge target object; and contacting an appending object to the adhesive placed on the discharge target object, compressing the appending object to the discharge target object, heating the adhesive placed between the discharge target object and the appending object, and fixing the appending object to the discharge target object. Preferably the append object is loaded (fixed) on the discharge target object by heating the appending object. Preferably the curing rate of the semi-cured adhesive is 2-20 %. Preferably the appending object is a semiconductor chip and the discharge target object is a flexible resin film.