METHOD AND APPARATUS FOR SEALING RESIN, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE AND RESIN MATERIAL, ENABLING DISSOLVED RESIN TO UNIFORMLY FLOW OVER THE WHOLE AREA ON SURFACE PARALLEL TO SUBSTRATE AND TO FLOW IN DEPTH DIRECTION OF CAVITY WITHIN VERY SHORT TIME

摘要

PURPOSE: A method and a apparatus for sealing resin, a method for manufacturing a semiconductor device, a semiconductor device and a resin material are provided to improve efficiency of resin material usage by preventing resin from being solidified. CONSTITUTION: An electronic component(15) mounted on a main surface of a board(14) is resin-sealed with a molded pair having an upper mold(2) and a lower mold(1). The board is attached on the upper mold. A melted resin(17) is generated in a cavity(5) provided in the lower mold. The electronic component is immersed in the melted resin by closing the mold pair. A resin product is produced by solidifying the melted resin in the cavity. The melted resin is formed by heating the resin material mounted on the cavity.