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PHOTOSENSITIVE COPPER CONDUCTIVE COMPOSITION, FORMATION OR CONSTITUTION METHOD OF GATE ELECTRODE OF FED DEVICE USING THE COMPOSITION AND VACUUM MICROELECTRONIC DEVICE AND LIGHTING DEVICE CONTAINING THE ELECTRODE TO OBTAIN HIGH RESOLUTION AND NECESSARY ELECTRICAL CONDUCTIVITY
PHOTOSENSITIVE COPPER CONDUCTIVE COMPOSITION, FORMATION OR CONSTITUTION METHOD OF GATE ELECTRODE OF FED DEVICE USING THE COMPOSITION AND VACUUM MICROELECTRONIC DEVICE AND LIGHTING DEVICE CONTAINING THE ELECTRODE TO OBTAIN HIGH RESOLUTION AND NECESSARY ELECTRICAL CONDUCTIVITY
PURPOSE: A photosensitive copper conductive composition, a method for forming or constituting the electrode of a field emission display device by using the composition, and a vacuum microelectronic device and a lighting device containing the electrode prepared by the method are provided, to obtain a thick film conductor having a low resistivity of 100 ¥Ø or less at a sintering temperature of 450-600 deg.C relatively easily, a high resolution and a good adhesive strength. CONSTITUTION: The photosensitive copper conductive composition comprises a mixture comprising 70 wt% or more of a copper powder having a particle size of 0.2-3 micrometers based on 100 wt% of a copper powder and 1-40 wt% of an inorganic binder having a softening point of 380-580 deg.C based on 100 wt% of a copper powder, wherein the mixture is dispersed in an organic diluent comprising an organic polymer binder, a photoinitiator, a radiation curable monomer and an organic solvent. The composition can be sintered at a temperature of 450-600 deg.C under reductive condition.
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