首页> 外国专利> METHOD FOR FABRICATING SEMICONDUCTOR DEVICE, AUTOMATIC OPERATION METHOD OF SEMICONDUCTOR FABRICATING APPARATUS, AUTOMATIC OPERATION SYSTEM OF SEMICONDUCTOR FABRICATING APPARATUS AND AUTOMATIC OPERATING METHOD OF CMP APPARATUS TO MAXIMUMLY INCREASE OPERATING RATIO AND IMPROVE THROUGHPUT

METHOD FOR FABRICATING SEMICONDUCTOR DEVICE, AUTOMATIC OPERATION METHOD OF SEMICONDUCTOR FABRICATING APPARATUS, AUTOMATIC OPERATION SYSTEM OF SEMICONDUCTOR FABRICATING APPARATUS AND AUTOMATIC OPERATING METHOD OF CMP APPARATUS TO MAXIMUMLY INCREASE OPERATING RATIO AND IMPROVE THROUGHPUT

机译:制造半导体装置的方法,半导体制造装置的自动操作方法,半导体制造装置的自动操作系统以及CMP装置的自动操作方法,以最大程度地增加工作比率并改进

摘要

PURPOSE: A method for fabricating a semiconductor device is provided to maximumly increase an operating ratio and improve throughput by minimizing an interval of standby time of an operator. CONSTITUTION: A process condition of a product wafer is transferred from a host computer(19) to a semiconductor fabricating apparatus. According to a predetermined process condition, a dummy wafer is automatically processed in the semiconductor fabricating apparatus. According to the transferred process condition of the product wafer, the product wafer is processed in the semiconductor fabricating apparatus.
机译:目的:提供一种用于制造半导体器件的方法,以通过最小化操作者的待机时间间隔来最大程度地提高操作率并提高生产率。组成:产品晶圆的工艺条件从主机(19)转移到半导体制造设备。根据预定的处理条件,在半导体制造设备中自动处理伪晶片。根据所传送的产品晶片的处理条件,在半导体制造设备中对产品晶片进行处理。

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