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PREPARATION OF ORGANIC AND INORGANIC LAYERS-STRUCTURED ELECTRONIC DEVICE HAVING IMPROVED THERMAL STABILITY
PREPARATION OF ORGANIC AND INORGANIC LAYERS-STRUCTURED ELECTRONIC DEVICE HAVING IMPROVED THERMAL STABILITY
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机译:具有改善的热稳定性的有机和无机层结构电子设备的制备
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摘要
PURPOSE: A method for fabricating an element having an inorganic layer and an organic layer is provided to improve thermal stability by performing a thermal process for the organic layer having the lowest thermal stability. CONSTITUTION: A substrate including ITO(Indium Tin Oxide) is cleaned. A PEDT-PSS layer of 15 weight percent is coated on an upper surface of the substrate including ITO(Indium Tin Oxide) by using a spin coating method. The PEDT-PSS layer is dried under temperature of 200 degrees centigrade during 10 minutes. An NPB layer is formed on the substrate including the PEDT-PSS layer under normal temperature by using a vapor deposition method. The deposited NPB layer has thickness of 500 angstrom. A thermal process for the NPB layer is performed under the temperature of 110 degrees centigrade during 30 minutes. A BCzVBi layer and an Al/LiF layer are deposited sequentially thereon.
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