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Method for single chamber processing of PECVD-Ti and CVD-TiN films in IC manufacturing
Method for single chamber processing of PECVD-Ti and CVD-TiN films in IC manufacturing
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机译:IC制造中peCVD-Ti和CVD-TiN膜的单腔处理方法
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摘要
A single chamber method for depositing a stack including titanium and titanium nitride on a wafer surface. Titanium is deposited by plasma enhanced chemical vapor deposition and then plasma nitrided. Titanium nitride is subsequently deposited by a thermal chemical vapor deposition process. Advantageously, the temperatures of the substrate and showerhead as well as the internal chamber pressure are maintained at substantially constant values throughout deposition of the stack.
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