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Single chamber processing method of PECVD-Ti film and CVD-TiN film in IC manufacturing
Single chamber processing method of PECVD-Ti film and CVD-TiN film in IC manufacturing
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机译:IC制造中的peCVD-ti膜和CVD-TiN膜的单室处理方法
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摘要
A single chamber method for depositing a stack including titanium and titanium nitride on a wafer surface. Titanium is deposited by plasma enhanced chemical vapor deposition and then plasma nitrided. Titanium nitride is subsequently deposited by a thermal chemical vapor deposition process. Advantageously, the temperatures of the substrate and showerhead as well as the internal chamber pressure are maintained at substantially constant values throughout deposition of the stack.
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