PURPOSE: A composite solder for increasing creep strength and reliability in solder and solder ball materials, and a manufacturing method of the composite solder are provided. CONSTITUTION: The manufacturing method of composite solder comprises the steps of forming an intermetallic compound in solder matrix by solidifying the molten solder alloy after melting the solder alloy by heating solder alloy having a composition in which an intermetallic compound to be reinforcement during solidification process is formed as primary crystal in the solder matrix to temperature of liquidus line or more; and milling the intermetallic compound in the solder matrix into fine particles by plastic working the intermetallic compound inside the solder matrix, wherein the intermetallic compound is a compound selected from CuSn5, Ni3Sn4, FeSn2, Cu3Sn, AgIn2, AuSn4, AuSn, InSn4, PdSn4, PdSn3, Sb2Sn3, SbSn, Sn4Sr, and Ti6Sn5, wherein the plastic working is drawing or rolling, wherein the composition of the solder matrix is an alloy containing tin (Sn) as a principal constituent and one or more elements selected from lead (Pb), silver (Ag), bismuth (Bi), indium (In), and copper (Cu), wherein the composition of the solder matrix is an alloy containing gold (Au) as a principal constituent, and wherein the composition of the solder matrix is an alloy containing indium (In) as a principal constituent and one or more elements selected from silver (Ag), bismuth (Bi), and copper (Cu).
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