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Resistor-buried multilayer low-temperature-cofired-ceramic substrate with flat surface and fabrication method thereof
Resistor-buried multilayer low-temperature-cofired-ceramic substrate with flat surface and fabrication method thereof
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机译:平整的电阻埋多层低温共烧陶瓷基板及其制造方法
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摘要
PURPOSE: A flat LTCC(Low Temperature Cofired Ceramic) multilayer substrate having a resistor and a fabricating method thereof are provided to reduce the surface curvature by performing simultaneously a firing process and a process for laminating a high-temperature firing material on a top side and a bottom side of a LTF ceramic laminator. CONSTITUTION: A resistor pattern and an internal electrode are formed on a first low temperature cofired green sheet. A via is formed on a second LTF(Low Temperature Fired) green sheet. A LTF ceramic laminator is formed by laminating the first and the second LTF green sheets. An HTF(High Temperature Fired) green sheet is fabricated and a via is formed on the HTF green sheet. A multilayer ceramic substrate is formed by adhering the HTF green sheet on a top side and a bottom side of the LTF ceramic laminator. The LTF green sheet and the HTF green sheet are unified by pressing the multilayer ceramic substrate. A firing process for the multilayer ceramic substrate is performed under the temperature of 800 to 900 degrees centigrade. An LTCC substrate is formed by cleaning and polishing the HTF green sheet. A surface circuit pattern is printed on the LTCC substrate.
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