首页> 外国专利> Resistor-buried multilayer low-temperature-cofired-ceramic substrate with flat surface and fabrication method thereof

Resistor-buried multilayer low-temperature-cofired-ceramic substrate with flat surface and fabrication method thereof

机译:平整的电阻埋多层低温共烧陶瓷基板及其制造方法

摘要

PURPOSE: A flat LTCC(Low Temperature Cofired Ceramic) multilayer substrate having a resistor and a fabricating method thereof are provided to reduce the surface curvature by performing simultaneously a firing process and a process for laminating a high-temperature firing material on a top side and a bottom side of a LTF ceramic laminator. CONSTITUTION: A resistor pattern and an internal electrode are formed on a first low temperature cofired green sheet. A via is formed on a second LTF(Low Temperature Fired) green sheet. A LTF ceramic laminator is formed by laminating the first and the second LTF green sheets. An HTF(High Temperature Fired) green sheet is fabricated and a via is formed on the HTF green sheet. A multilayer ceramic substrate is formed by adhering the HTF green sheet on a top side and a bottom side of the LTF ceramic laminator. The LTF green sheet and the HTF green sheet are unified by pressing the multilayer ceramic substrate. A firing process for the multilayer ceramic substrate is performed under the temperature of 800 to 900 degrees centigrade. An LTCC substrate is formed by cleaning and polishing the HTF green sheet. A surface circuit pattern is printed on the LTCC substrate.
机译:用途:提供具有电阻器的扁平LTCC(低温共烧陶瓷)多层基板及其制造方法,以通过同时执行焙烧过程和将高温焙烧材料层压在顶面上的过程来减小表面曲率,并LTF陶瓷层压机的底面。组成:电阻器图案和内部电极形成在第一层低温共烧生片上。在第二个LTF(低温烧制)生片上形成通孔。通过层压第一和第二LTF生片来形成LTF陶瓷层压机。制造HTF(高温烧制)生片,并在HTF生片上形成通孔。通过将HTF生片粘附在LTF陶瓷层压机的顶侧和底侧上来形成多层陶瓷基板。通过按压多层陶瓷基板,使LTF生片和HTF生片一体化。在800至900摄氏度的温度下执行用于多层陶瓷基板的烧制工艺。 LTCC基板是通过清洁和抛光HTF生片而形成的。将表面电路图案印刷在LTCC基板上。

著录项

  • 公开/公告号KR100447032B1

    专利类型

  • 公开/公告日2004-09-07

    原文格式PDF

  • 申请/专利权人

    申请/专利号KR20020075744

  • 发明设计人 박성대;유명재;조현민;

    申请日2002-12-02

  • 分类号H05K3/46;

  • 国家 KR

  • 入库时间 2022-08-21 22:46:45

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