Process for connecting chips comprises applying a spacer on prepared chips, applying an adhesive on the main surfaces, aligning the chips and joining the chips, and hardening the adhesive to form a solid connection

摘要

Process for connecting chips comprises preparing first chip (1) with first main surface (HF1), preparing second chip (1') with second main surface (HF2) and third main surface (HF3), applying spacer (4) on chips to secure predetermined distance (h) between chips, applying adhesive (8) on first or second main surface, aligning first chip on second chip and joining chips, and hardening adhesive to form solid connection. An Independent claim is also included for a composite chip arrangement prepared by the above process.