Multiple layer switch support used in flip-chip technology comprises a semiconductor chip and/or a discrete component, a rewiring layer, an insulating layer with through-structures, and outer contact surfaces

摘要

Multiple layer switch support (1) comprises a semiconductor chip (2) and/or a discrete component (3), a rewiring layer (5) having a rewiring structure (4), an insulating layer (7) with through-structures (6), and outer contact surfaces (8) arranged on the lower side (9) of the switch support as outer contact layer. Multiple layer switch support (1) comprises a semiconductor chip (2) and/or a discrete component (3), a rewiring layer (5) having a rewiring structure (4), an insulating layer (7) with through-structures (6), and outer contact surfaces (8) arranged on the lower side (9) of the switch support as outer contact layer. An anchoring layer (12) is arranged between the rewiring layer and the insulating layer and contains metallic plates (13) for fixing the through-structures in the switch support. The outer contact surfaces and the metallic plates are electrically connected to the rewiring structure. Independent claims are also included for processes for the production of the switch support.