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Process for solder-stop structuring protrusions on wafers such as three dimensional contact structures for improving integration comprises depositing a resist on the three dimensional structure, and further processing
Process for solder-stop structuring protrusions on wafers such as three dimensional contact structures for improving integration comprises depositing a resist on the three dimensional structure, and further processing
Process for solder-stop structuring protrusions on wafers (3) such as three dimensional contact structures (1) in the form of elastic or flexible contact bumps comprises depositing a resist on the tip of the three dimensional structure, depositing a solder-stop layer over a metallization including the resist, and removing the resist on the tip of the three dimensional structure including the solder-stop layer covering it.
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