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Electrolyte used in process for high speed electroless plating with nickel film having residual compressive stress is based on nickel acetate and also contains reducing agent, chelant, accelerator and stabilizer
Electrolyte used in process for high speed electroless plating with nickel film having residual compressive stress is based on nickel acetate and also contains reducing agent, chelant, accelerator and stabilizer
In an electrolyte for electroless plating with nickel films with residual compressive stress, containing a nickel base salt (I), reducing agent, chelant, accelerator and stabilizer, (I) is Ni acetate in an initial concentration of 12-26 g/l. An Independent claim is also included for the process for electroless plating with this electrolyte, in which uniform Ni films are deposited at a constant high rate of deposition of not less than 7-12 microns/hour, with a throughput of not less than 15-22 MTO (metal turn-over) = 70-110 g Ni/l.
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机译:在用于具有残余压应力的镍膜的化学镀的电解质中,该电解质包含镍碱盐(I),还原剂,螯合剂,促进剂和稳定剂,(I)为乙酸镍,初始浓度为12-26 g / l。该电解质的化学镀方法也包括独立权利要求,其中均匀的Ni膜以不小于7-12微米/小时的恒定高沉积速率沉积,且产量不小于15- 22 MTO(金属周转量)= 70-110 g Ni / l。
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