Process for pre-treating surfaces or bonding surfaces of substrates to be joined used in semiconductor technology comprises applying an atmospheric plasma before the bonding process is carried out

摘要

Process for pre-treating surfaces or bonding surfaces of substrates (1, 1') to be joined comprises applying an atmospheric plasma before the bonding process is carried out. An Independent claim is also included for a device for pre-treating the surfaces or bonding surfaces of the substrates comprising a unit for producing a plasma (2) through a corona discharge with high voltage electrodes (31, 32) and supports (4, 4') on which the substrates are placed.