LED chip manufacturing method for LED light source, involves filling pouring material containing light-emission material and light-emission transformation material, into trenches of bonding layer inserted into injection mold

摘要

The method involves forming trenches on a bonding layer adhered to a support substrate. The bonding layer is then inserted into a cavity of an injection mold (2). A pouring material (3) containing light-emission material and light-emission transformation material, is filled into the trenches of the bonding layer, after which the injection mold is removed.