Production process for a bulk acoustic wave component for filters in mobile telecommunication breaks ground interconnections between chips when sawing wafer

摘要

A production process for bulk acoustic wave (BAW) components comprises forming many chips (CH) on a wafer (WA) with multiplayer BAW resonators (S,P) on each chip with electrical ground connections between them (G) to ease the control of transmission properties. The connections are broken when the chips are separated along saw lines (SL).