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Measuring device used as a current density probe during galvanization of circuit boards comprises an electrically conducting measuring surface, an electrical connection, and two electrical conductors
Measuring device used as a current density probe during galvanization of circuit boards comprises an electrically conducting measuring surface, an electrical connection, and two electrical conductors
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机译:在电路板镀锌过程中用作电流密度探针的测量设备,包括一个导电的测量表面,一个电连接和两个电导体
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摘要
Measuring device for measuring the locally acting current density during galvanization of circuit boards using a direct current, unipolar or bipolar pulsed current in electrolytic cells comprises an electrically conducting measuring surface (6) having a determined surface content and an electrically conducting rear side contact, an electrical connection consisting of electrical conductors and a shunt (10) for electrically connecting the measuring surface and the rear side contact, and two electrical conductors (19) which utilize the measuring signal of the shunt and introduce an amplification and/or evaluation. The measuring surface is electrically insulated from the contact using an insulator (11). An Independent claim is also included for a measuring process for measuring the locally acting current density during galvanization of circuit boards using a direct current, unipolar or bipolar pulsed current in electrolytic cells.
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