首页> 外国专利> Measuring device used as a current density probe during galvanization of circuit boards comprises an electrically conducting measuring surface, an electrical connection, and two electrical conductors

Measuring device used as a current density probe during galvanization of circuit boards comprises an electrically conducting measuring surface, an electrical connection, and two electrical conductors

机译:在电路板镀锌过程中用作电流密度探针的测量设备,包括一个导电的测量表面,一个电连接和两个电导体

摘要

Measuring device for measuring the locally acting current density during galvanization of circuit boards using a direct current, unipolar or bipolar pulsed current in electrolytic cells comprises an electrically conducting measuring surface (6) having a determined surface content and an electrically conducting rear side contact, an electrical connection consisting of electrical conductors and a shunt (10) for electrically connecting the measuring surface and the rear side contact, and two electrical conductors (19) which utilize the measuring signal of the shunt and introduce an amplification and/or evaluation. The measuring surface is electrically insulated from the contact using an insulator (11). An Independent claim is also included for a measuring process for measuring the locally acting current density during galvanization of circuit boards using a direct current, unipolar or bipolar pulsed current in electrolytic cells.
机译:用于在电解池中使用直流,单极或双极脉冲电流在电路板镀锌过程中测量局部作用电流密度的测量装置,包括具有确定的表面含量的导电测量表面(6)和导电的背面触点,电连接包括电导体和用于电连接测量表面和后侧触点的分流器(10),以及两个利用分流器的测量信号并进行放大和/或评估的电导体(19)。使用绝缘子(11)将测量表面与触点电绝缘。还包括用于测量过程的独立权利要求,该测量过程用于使用电解池中的直流,单极性或双极性脉冲电流在电路板镀锌期间测量局部作用的电流密度。

著录项

  • 公开/公告号DE10304176B3

    专利类型

  • 公开/公告日2004-04-08

    原文格式PDF

  • 申请/专利权人 HUEBEL EGON;

    申请/专利号DE2003104176

  • 发明设计人 HUEBEL EGON;

    申请日2003-01-25

  • 分类号C25D21/12;G01R19/08;G01R15/04;G08C17/02;

  • 国家 DE

  • 入库时间 2022-08-21 22:43:31

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