A process for the preparation of a chip set by means of a heat - and printing process using a thermoplastic material

摘要

The device relates to a process for the preparation of a chip set, or composite wafer by means of a heat - and printing process, as well as a device for carrying out the method. For the carry out the process, a chip carrier plate (2) and a transfer plate (5) in the apparatus are made available. The method comprises the operation of loading the chip carrier plate (2) with semiconductor chips (4) and a heating of the plates (2, 5). In this context, one of the plates dimensionally stable, while the semiconductor chips in the other deformable plate are pressed.