Sacrificial layer removal method for semiconductor technology using microchannels formed in structured layer for transporting removal medium to sacrificial layer

摘要

The sacrificial layer removal method has microchannels formed in at least one structured layer between a first substrate and a second substrate provided with a sacrificial layer, with full or partial insertion of the substrate arrangement (2) in a housing (1) having an entry opening (10) at one end and an exit opening (11) at the opposite end. A seal is provided between the exit opening and the substrate arrangement and the entry opening is supplied with a sacrificial layer removal medium, the microchannels used for supplying it to the sacrificial layer. An independent claim for a sacrificial layer removal device is also included.