首页> 外国专利> Production of an electronic switching arrangement for vehicles, comprises applying a switching structure to a base, connecting wires to the base, electrically connecting the wires with the switching structure, and further processing

Production of an electronic switching arrangement for vehicles, comprises applying a switching structure to a base, connecting wires to the base, electrically connecting the wires with the switching structure, and further processing

机译:用于车辆的电子开关装置的生产包括:将开关结构应用于基座,将电线连接至基座,将电线与开关结构电连接,以及进一步处理

摘要

Production of an electronic switching arrangement comprises applying an electronic switching structure including a switching substrate (7) with switching elements (6) to a base (2), connecting wires (3a) via frames with the base before casting the wires with a casting resin (4). Production of an electronic switching arrangement comprises applying an electronic switching structure including a switching substrate (7) with switching elements (6) to a base (2), connecting wires (3a) via frames with the base before casting the wires with a casting resin (4) which is made from a different material than the base, electrically connecting the wires with the electronic switching structure, casting the switching structure, wires and flange except the flange and the wires applied on the base, and removing the frame from the wires and the base after casting with the resin. Independent claims are also included for the following: (1) Alternative processes for the production of the electronic switching arrangement; and (2) Electronic switching arrangements.
机译:电子开关装置的制造包括将电子开关结构施加到基座(2)上,该电子开关结构包括带有开关元件(6)的开关基板(7),通过框架将引线(3a)与基座连接,然后用浇铸树脂浇铸引线。 (4)。电子开关装置的制造包括将电子开关结构施加到基座(2)上,该电子开关结构包括带有开关元件(6)的开关基板(7),通过框架将引线(3a)与基座连接,然后用浇铸树脂浇铸引线。 (4)由与基座不同的材料制成,将电线与电子开关结构电连接,铸造除凸缘和施加在基座上的电线以外的开关结构,电线和法兰,并从电线上拆下框架和树脂浇铸后的基础。还包括以下方面的独立权利要求:(1)生产电子开关装置的替代方法; (2)电子开关装置。

著录项

  • 公开/公告号DE10338087A1

    专利类型

  • 公开/公告日2004-04-08

    原文格式PDF

  • 申请/专利权人 HITACHI LTD.;

    申请/专利号DE2003138087

  • 发明设计人 KAWAKAMI KAZUHIKO;URUSHIWARA NORIYOSHI;

    申请日2003-08-19

  • 分类号H01L21/60;H01L21/56;H01L23/50;

  • 国家 DE

  • 入库时间 2022-08-21 22:43:16

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号