首页> 外国专利> Vacuum suction device and operating process for sucking and transporting light objects such as chip elements has valve control of suction and releasing overpressure

Vacuum suction device and operating process for sucking and transporting light objects such as chip elements has valve control of suction and releasing overpressure

机译:具有抽吸和释放超压的阀门控制的真空抽吸装置和用于抽吸和运输切屑元件等轻质物体的操作过程

摘要

A vacuum suction device comprises a suction head (21) for a workpiece (W) and a two-position valve (24) for applying vacuum (22) or overpressure (23). The releasing overpressure is equal to, or less than, the surrounding pressure so that the workpiece is released by its own weight. An Independent claim is also included for an operating process for the above.
机译:真空抽吸装置包括用于工件(W)的抽吸头(21)和用于施加真空(22)或超压(23)的二位阀(24)。释放超压等于或小于周围压力,以使工件通过自重释放。上述操作流程也包括独立权利要求。

著录项

  • 公开/公告号DE10341046A1

    专利类型

  • 公开/公告日2004-03-11

    原文格式PDF

  • 申请/专利权人 SMC CORP. TOKIO/TOKYO;

    申请/专利号DE2003141046

  • 发明设计人 MAKADO SHOICHI;FUKANO YOSHIHIRO;

    申请日2003-09-03

  • 分类号B65G47/91;

  • 国家 DE

  • 入库时间 2022-08-21 22:43:10

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号