Selective soldering device for soldering components onto circuit boards, has outlet opening at known distance from top of pipe in each pipe extending vertically above solder container

摘要

The device has a container (1) for holding and heating molten solder (2), a transport arrangement for objects to be soldered, at least one pipe (5-9) extending vertically above the solder container. A pump arrangement feeds molten solder to the base of the pipe and an arrangement is provided for moving the underside of the objects and the top of the pipe at least close to each other. An outlet opening is provided at a known distance from the top of each pipe. An independent claim is also included for a plate with a row of pipes attached which can be used with the device.