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Encapsulated temperature sensor fabricated using thin film technology for use at high temperatures up to 600 degrees C, has a partially glass housing to prevent deformation at said temperatures

机译:采用薄膜技术制造的封装温度传感器,可在高达600摄氏度的高温下使用,具有部分玻璃外壳,可防止在所述温度下变形

摘要

Resistance temperature sensor (1) is held within a pressure tight, rigid housing (3), whereby a metallic pin (5) extends into the inside of the housing and acts as a heat conductor. At least a part of the housing (3.2) is made from glass, with the pin at least partially melted into the housing.
机译:电阻温度传感器(1)固定在耐压的刚性外壳(3)中,金属销(5)伸入外壳内部并用作导热体。壳体(3.2)的至少一部分由玻璃制成,并且销至少部分地熔化到壳体中。

著录项

  • 公开/公告号DE20318550U1

    专利类型

  • 公开/公告日2004-06-03

    原文格式PDF

  • 申请/专利权人 UST UMWELTSENSORTECHNIK GMBH;

    申请/专利号DE2003218550U

  • 发明设计人

    申请日2003-12-01

  • 分类号G01K7/18;G01K1/14;

  • 国家 DE

  • 入库时间 2022-08-21 22:42:23

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