首页> 外国专利> PROCESS FOR PRODUCING THREE-DIMENSIONAL MICROWAVE TRANSMISSION CIRCUIT, AND THREE-DIMENSIONAL MICROWAVE TRANSMISSION CIRCUIT BOARD PRODUCED USING PROCESS

PROCESS FOR PRODUCING THREE-DIMENSIONAL MICROWAVE TRANSMISSION CIRCUIT, AND THREE-DIMENSIONAL MICROWAVE TRANSMISSION CIRCUIT BOARD PRODUCED USING PROCESS

机译:制作三维微波传输电路的方法以及用该方法制作的三维微波传输电路板

摘要

PROBLEM TO BE SOLVED: To produce a high performance three-dimensional microwave transmission circuit inexpensively.;SOLUTION: A metal plate material is employed as the material of electrode pattern on the three-dimensional microwave transmission circuit board, and machined into the electrode pattern by means of a press and then insert molded with molding resin thus constituting the three-dimensional microwave transmission circuit board. A production process of the three-dimensional microwave transmission circuit board employs a sequential feed production system in which a hoop material 121 is employed as the metal plate material, fed sequentially through presses 123 and 124, a former press 125 and an injection molding machine 126 to produce a three-dimensional microwave transmission circuit board material 110. Subsequently, it is cut from the hoop material 121 and metal plating is applied to the electrode pattern part. Since the three-dimensional microwave transmission circuit boards are mass produced, production efficiency is enhanced and man-hour can be reduced. Furthermore, the three-dimensional microwave transmission circuit board produced by this production process exhibits excellent conductivity and heat dissipation properties.;COPYRIGHT: (C)2006,JPO&NCIPI
机译:解决的问题:廉价地制造高性能的三维微波传输电路。解决方案:金属板材料用作三维微波传输电路板上电极图案的材料,并通过以下方法加工成电极图案:然后用压力机压模,然后用模制树脂插入模制件,从而构成三维微波传输电路板。三维微波传输电路板的生产过程采用顺序进料生产系统,其中采用箍材料121作为金属板材料,依次通过压力机123和124,前压机125和注塑机126进料。从而制造三维微波传输电路板材料110。随后,将其从箍材料121上切割下来,并在电极图案部分进行金属电镀。由于三维微波传输电路板是批量生产的,因此提高了生产效率并且可以减少工时。此外,通过这种生产工艺生产的三维微波传输电路板具有优异的导电性和散热性能。;版权所有:(C)2006,JPO&NCIPI

著录项

  • 公开/公告号JP2005285841A

    专利类型

  • 公开/公告日2005-10-13

    原文格式PDF

  • 申请/专利权人 KAWAGUCHIKO SEIMITSU CO LTD;

    申请/专利号JP20040093464

  • 发明设计人 NAKAMURA SHINOBU;

    申请日2004-03-26

  • 分类号H05K3/20;H05K1/02;H05K3/00;

  • 国家 JP

  • 入库时间 2022-08-21 22:37:38

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