首页> 外国专利> METHOD FOR MANUFACTURING THERMOSETTING RESIN COMPOSITION FOR CASTING, THERMOSETTING RESIN COMPOSITION FOR CASTING AND ELECTORICAL/ELECTRONIC COMPONENT DEVICE

METHOD FOR MANUFACTURING THERMOSETTING RESIN COMPOSITION FOR CASTING, THERMOSETTING RESIN COMPOSITION FOR CASTING AND ELECTORICAL/ELECTRONIC COMPONENT DEVICE

机译:铸造用热固性树脂组合物的制造方法,铸造用热固性树脂组合物及电气/电子零件

摘要

PROBLEM TO BE SOLVED: To provide a thermosetting resin composition for casting superior in impregnating ability, electrical properties and mechanical properties of a hardened product, even when a large amounts of inorganic fillers are added, that controls deterioration in impregnating ability due to inclusion of crushed fine powders and controls inclusion of a metallic component due to abrasion of a mixing vessel.;SOLUTION: This resin composition comprises (A) a 100 pts.wt. epoxy resin and (B) a 150-300 pts.wt. inorganic filler as essential components. The method for manufacturing the resin comprises addition of (B) the inorganic filler, after heating (A) the epoxy resin to a temperature of ≥100°C to ≤200°C.;COPYRIGHT: (C)2006,JPO&NCIPI
机译:要解决的问题:提供一种即使在添加大量无机填料的情况下,也具有优异的浸渍产品的浸渍能力,电性能和机械性能的,用于浇铸的热固性树脂组合物,该组合物可控制由于包含碎料而导致的浸渍性能的下降。细粉,并控制由于混合容器的磨损而导致的金属成分的夹杂物。解决方案:该树脂组合物包含(A)100pts.wt。环氧树脂和(B)150-300 pts.wt.无机填料为必不可少的成分。用于制造树脂的方法包括在将(A)环氧树脂加热到100摄氏度至200摄氏度的温度后添加(B)无机填料。版权所有:(C)2006,JPO&NCIPI

著录项

  • 公开/公告号JP2005290131A

    专利类型

  • 公开/公告日2005-10-20

    原文格式PDF

  • 申请/专利权人 KYOCERA CHEMICAL CORP;

    申请/专利号JP20040105335

  • 发明设计人 SHIBATA TOMOAKI;

    申请日2004-03-31

  • 分类号C08J3/20;H01L23/29;H01L23/31;

  • 国家 JP

  • 入库时间 2022-08-21 22:37:32

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